What is Moisture Sensitivity Level? MSL is an electronic standard that indicates when moisture-sensitive devices can be exposed to ambient room moisture. MSL is relevant to J-STD-020 packaging and handling precautions.
These are small semiconductor devices, such as QFP, BGA, TSSOP, SOP, etc. It is encapsulated with plastic compounds & other organic materials, which absorb moisture from atmospheric Humidity.
SMT components, the entire assembly is placed into reflow ovens. The temperature is raised close to the solder’s melting (210° to 250°C) point and then spiked up to liquefy the solder and create the connections between SMT component leads and the PCB.
In the entire PCB reflow soldering process, absorbed moisture is quickly turned into superheated steam, causing dramatic cracking or damage to the package. Most of this damage is not visible on the component surface.
What is Moisture Sensitivity Level Chart
Below is an explanation of the standard moisture sensitivity level (MSL) used by IPC/JEDEC. Expect Moisture Sensitivity Level chart 6 – Mandatory to Bake before use.
Presently, there are seven categories of msl level for electronic components. Unsurprisingly, devices with low floor levels tend to last longer on floors. Every package manufacturer wants to achieve level 1, which means their package has an unlimited floor life.
As the industry standard for moisture sensitivity definitions, JEDEC defines a classification of moisture sensitivity. By setting a fixed reflow temperature, such as in the following Table, this standard will identify the moisture sensitivity level, allowing the user to properly store and handle the devices and prevent damage from subsequent thermal/mechanical activities such as attachment reflow and repairs.
msl baking table and consideration
When the moisture sensitivity level bake time is exposed to production ambient conditions of 60% relative humidity for a sufficient time, it can be dried by high- or low-temperature baking, as shown in the Table in the next slide re-baking before reflow.
Plastic packages can be detached from semiconductor chips or lead frames by this internal vapor pressure, causing cracks internally or externally and damaging thin films and wire bonds. When faced with a moist integrated circuit package, soldering may cause it to bulge or even explode in severe cases.
Moisture can enter semiconductor devices encapsulated in plastic when improperly stored, handled or packaged. A package that is enclosed in plastic can become damaged when moisture inside vaporizes during soldering.
The floor lifetime begins when the Moisture Barrier Bag is opened. The following table will be used for baking if an MBB is opened and its components will not be used within the specified floor life.
General Considerations for Baking
The pre-baking and post-baking steps in the MSD component baking can be classified as two different types. Components prepared for dry packing are pre-baked, while those that have passed their shelf life are post-baked. The temperature and baking time must be carefully calculated, as improper baking can cause lead oxidation, leading to poor solderability. It’s really important to understand how to bake at the right temperature. I have included a J-STD-33 chart below, detailing ideal baking conditions.
Important Definitions
Floor Live:- The allowable period after removal from a moisture barrier bag, dry storage, or dry bake and before the solder reflow process.
Humidity Indicator Card (HIC):- A card on which a moisture-sensitive chemical is applied such that it will make a significant, perceptible change in color (hue), typically from blue (dry) to pink (wet) when the indicated relative Humidity is exceeded.
Desiccant:-An absorbent material used to maintain a low relative humidity (less than 10% at 25°C) in moisture barrier bags for dry-packing moisture-sensitive devices. Desiccant may be a silica gel or other absorbent material packed in dustless pouches.
Moisture Barrier Bag (MBB): This bag limits water vapor transmission when packaging moisture-sensitive devices. The moisture barrier bag (dry pack bag) must be handled carefully for the plastic packages not to absorb moisture. Microsemi devices will remain safe as a result.
Shelf Life: A dry-packed moisture-sensitive device can only be stored in an unopened Moisture barrier bag (MBB) for a certain amount of time. The specified interior bag humidity does not exceed the recommended amount.
The shelf life for dry-packed moisture sensitivity level (MSL) SMD packages shall be a minimum of 12 months from the bag packed date when stored in a noncondensing atmospheric environment of <40°C/90% RH.
Dry Pack consists of desiccant material and a humidity indicator card (HIC) sealed with the components inside a moisture barrier bag (MBB).
FAQ
Q. #1) how to determine moisture sensitivity level?
Ans. The moisture sensitivity level can be determined by the data sheet of Package Qualification Summary Report. Based on that moisture sensitive device can be exposed to ambient room conditions.
Q. #2) What is moisture sensitivity level 1?
Ans: The moisture sensitivity level 1 guidelines to avoid damage from moisture absorption is that you can store Unlimited (30℃ less than 85%RH) on shop floor.
Conclusion – Wrapping it up
As a result, efficient moisture sensitivity level (MSL) control has become essential for EMS companies, particularly for high-reliability products.
As a result of moisture trapped inside the plastic packages, when they are soldered, they can be damaged. The moisture sensitivity of Microsemi’s plastic packaged FPGAs is tested according to JEDEC procedures. The moisture Sensitivity Level (MSL) ranges from 3 to 4.
Suppose a user plans to store any device beyond the recommended floor life at a temperature or relative Humidity above their recommendation. In that case, Microsemi recommends the user perform a bake-out before reflow soldering.
Furthermore, medical, automotive, aerospace, and defense markets require high mix/low volume assembly lines. In such environments, the total exposure time of MSDs increases significantly due to the cumulative effect of multiple machine feeder setups and product changeover.
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